Advancing Thermal Solutions for High-Performance Electronics
About TCLAD
TCLAD develops and manufactures advanced thermal management technologies designed for high-power, high-reliability electronic applications. Their core offerings include thermally conductive circuit boards and thermal interface materials, all produced within a vertically integrated manufacturing operation in Prescott, Wisconsin.
Engineered to efficiently move heat while preserving electrical performance, TCLAD solutions support increased power density, improved operational efficiency, and long-term durability. Proprietary materials and manufacturing processes are optimized to lower thermal resistance, limit mechanical stress, and deliver consistent performance in demanding environments.
TCLAD partners with customers across aerospace and defense, automotive, and industrial markets, providing hands-on engineering collaboration, fast-turn prototyping, and custom solutions to address complex thermal challenges from early design through full production.
TCLAD’s IMS® products are built for extreme thermal demands, delivering superior heat transfer, reduced thermal impedance, and enhanced structural reliability compared to traditional FR-4 boards. These solutions are widely used in mission-critical applications such as radar systems, directed-energy platforms, and unmanned aerial vehicles.
A comprehensive range of high-performance thermal interface materials designed to maximize heat transfer between components and heat-dissipating surfaces. Offerings include thermal pads, gap fillers, greases, gels, phase-change materials, and thermally conductive inks — all RoHS compliant and engineered for high-power assemblies.
TCLAD provides robust overcurrent protection solutions that allow real-time current monitoring and rapid response to electrical faults. These devices help safeguard systems, improve efficiency, and enhance operational safety across diverse applications.
An industry-leading selection of dielectric materials offering exceptional design flexibility. Available across multiple PCB constructions, including IMS®, prepreg composites, thin core series (TCS), and rigid copper-clad laminates.
High-performance dielectric fluids designed for direct immersion cooling of dense, heat intensive electronic systems. These electrically non-conductive and non-corrosive fluids allow safe submersion of sensitive components while delivering highly efficient, source-level heat removal for superior thermal control.
As electronic power densities continue to rise, TCLAD engineers develop advanced materials that enable systems to operate at higher temperatures, voltages, and switching frequencies. These board-level solutions are critical for maintaining efficiency, reliability, and longevity.
TCLAD’s SMTB technology enhances heat spreading directly across the PCB, minimizing hotspots and improving overall thermal performance. This innovation reduces reliance on bulky heatsinks, allowing for smaller system footprints and lower total system cost.
TCLAD maintains rigorous electrical and thermal testing programs within its advanced laboratories and undergoes regular audits to ensure adherence to the highest global quality and safety standards.
Please contact us to learn how our capabilities and services can meet your requirements.